[PDF.69ed] 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

[PDF.fm74] 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

3D Stacked Chips: From From Springer epub
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 | #5042907 in Books |  2016-05-11 | Original language:English | PDF # 1 |  9.21 x.81 x6.14l,.0 | File type: PDF | 339 pages

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|| ||“The book is valuable as a learning tool for 3D stacked chips through TSVs … . a valuable addition to a scientific library, as well as served as good introduction for device reliability engineers or specialists and industrials involved in the fie

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-b...

You can specify the type of files you want, for your gadget.3D Stacked Chips: From Emerging Processes to Heterogeneous Systems   |  From Springer. I was recommended this book by a dear friend of mine.

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